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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com d/a converters standard 8bit 2ch ? 3ch type bh2219fvm bh2220fvm general description the bh2219fvm and bh2220fvm are 8bit r- 2r -type d/a converters with 2 and 3 channels, respectively. a compact package allows adjacent placement, thereby eliminating deterioration of the d/a converter due to wire pattern. furthermore, a built-in reset function ensures that the output voltage at all channels is low during power up. a broad power supply voltage range (2.7v-5.5v) is available, providing design flexibility. features compact package enabling adjacent placement built-in reset function high speed output response characteristics 3-line serial interface application s dvcs, dscs, dvds, cd-rs, cd-rws key specifications ? power source voltage range: 2.7v to 5.5v ? current consumption: 0.4 ma (typ) ? differential non linearity error: 1.0lsb ? integral non linearity error: 1.5lsb ? output current performance: 1.0ma ? settling time: 100s(min) ? maximum data transfer frequency: 10 mhz(max) ? action temperature range: - 30 c to +85c package w(typ) x d(typ) x h(max) lineup number of channels input method data latch method package orderable part number 2ch cmos ld method msop8 reel of 3000 bh2219fvm-tr 3ch bh2220fvm- tr msop8 2.90 mm x 4.00mm x 0.90 mm datashee t datashee t downloaded from: http:///
bh2219fvm bh2220fvm 2/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pin description and block diagram (bh2219fvm) terminal terminal name function 1 ao1 analog output terminal 2 ao2 3 test moni test terminal (open at normal use) 4 vcc power source terminal 5 gnd ground termi nal 6 di serial data input terminal 7 clk serial clock input terminal 8 ld serial data load input terminal (bh2220fvm) terminal terminal name function 1 ao1 analog output terminal 2 ao2 3 ao3 4 vcc power source terminal 5 gnd ground terminal 6 di serial data input terminal 7 clk serial clock input terminal 8 ld serial data load input terminal absolute maximum ratings (ta=25 c ) parameter symbol limit unit remark power source voltage v cc -0.3 to +7.0 v - terminal voltage v in -0.3 to v cc v - storage temperature range tstg -55 to +125 c - power dissipation pd 0.47 (note 1) w - (note 1) derated at 4.7mw/c at ta>25 c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=25 c ) parameter symbol limit unit remark min typ max vcc power source voltage v cc 2.7 - 5.5 v - terminal input voltage range v in 0 - v cc v - analog output current i o ut -1.0 - +1.0 ma - action temperature range t opr - 30 - + 85 c - serial clock frequency f sclk - 1.0 10.0 mhz - limit load capacitance c l - - 0.1 f - 3 test moni 1 ao1 serial interface power on reset 2 ao2 4 vcc 8 ld 7 clk 6 di 5 gnd r2r reg vcc vcc r2r reg vcc vcc vcc vcc top view figure 1. bh2219fvm figure 2. bh2220fvm top view power on reset downloaded from: http:///
bh2219fvm bh2220fvm 3/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified, v cc =3.0v, r l =open, c l =0pf, ta=25 c ) parameter symbol limit unit conditions min typ max < cu rrent consumption> vcc system i cc - 0.4 0.8 ma clk=1mhz, 80h setting l input voltage v il gnd - 0.2v cc v - h input voltage v ih 0.8v cc - v cc v - input current i in - 10 - + 10 a - output zero scale voltage v zs1 gnd - 0.1 v 00h setting , at no load v zs2 gnd - 0.3 v 00h setting , i oh =1.0ma output full scale voltage v fs1 v cc -0.1 - v cc v ffh setting , at no load v fs2 v cc -0.3 - v cc v ffh setting , i ol =1.0ma differential non linearity error dnl -1.0 - +1.0 lsb input code 02h to fdh integral non linearity error inl -1.5 - +1.5 lsb input code 02h to fdh vcc power source voltage rise time t rvcc 100 - - s v cc = 0v to 2.7v power on reset release voltage v por - 1.9 - v - timing chart (unless otherwise specified, v cc = 3.0v, ta = 25c) parameter symbol limits unit conditions min typ max clk l level time t clkl 50 - - ns - clk h level time t clkh 50 - - ns - di setup time t sdi 20 - - ns - di hold time t hdi 40 - - ns - ld setup time t sld 50 - - ns - ld hold time t hld 50 - - ns - ld h level time t ldh 50 - - ns - output settling time t out - - 100 s c l =50pf, r l =10k figure 3 t clkl t clkh t sdi t hdi last data t sld t ldh t hld t out clk di ld analog output 0.8v cc 0.2v cc 0.8v cc 0.2v cc 0.8v cc 0.2v cc 90% 10% downloaded from: http:///
bh2219fvm bh2220fvm 4/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves figure 4 . circuit current vs supply voltage (acti ve cu rrent consumption) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage:vcc[v] circu it c urr ent:icc [ma ] 85 25 - 30 supply voltage : v cc [v] circuit current : i cc [ma] figure 5 . dc offset voltage vs temperature -0.60 -0.40 -0.20 0.00 0.20 0.40 0.60 -50 -25 0 25 50 75 100 temparature:ta[ ] offset voltage:voff[mv] code=80h temperature : ta [c] offset voltage : v off [mv] figure 6 . output voltage vs input code 0 500 1000 1500 2000 2500 3000 0 64 128 192 256 input code [dec] output voltage:vo[mv] v cc =3.0v input code [dec] output voltage : v out [mv] figure 7 . differential non linearity error vs input code -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0 64 128 192 256 input code [dec] dnl [lsb] v cc =3.0v input code [dec] differential non linearity error : dnl [lsb] downloaded from: http:///
bh2219fvm bh2220fvm 5/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued figure 10 . integral non linearity error vs supply voltage 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage:vcc[v] inl [lsb] supply voltage : v cc [v] integral non linearity error : inl [lsb] figure 11 . output zero scale voltage vs supply voltage 0.0 20.0 40.0 60.0 80.0 100.0 120.0 140.0 160.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage:vcc[v] zero scale volt age:z s[mv 85 - 30 i l =1.0ma 25 supply voltage : v cc [v] zero scale voltage : v zs 2 [mv] -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 0 64 128 192 256 input code [dec] inl [lsb] v cc =3.0v input code [dec] integral non linearity error : inl [lsb] figure 8 . integral non linearity error vs input code 0.00 0.05 0.10 0.15 0.20 0.25 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage:vcc[v] dnl [lsb] supply voltage : v cc [v] differential non linearity error : dnl [lsb] figure 9 . differential non linearity error vs supply voltage downloaded from: http:///
bh2219fvm bh2220fvm 6/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued figure 14 . settling time vs supply voltage 0 20 40 60 80 100 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage:vdd[v] se ttling time:tout[s] 85 c - 30 c 25 c supply voltage : v cc [v] settling time : t out [s] figure 15 . input voltage vs supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage:vdd[v] input voltage:vil,vih[v] v ih v il supply voltage : v cc [v ] input voltage : v il , v ih [v] figure 12 . output full scale voltage vs supply voltage -100 -80 -60 -40 -20 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage:vcc[v] full scale volt age:fs[mv 85 c -30c i l =1.0ma 25 c supply voltage : v cc [v] full scale voltage : v fs2 [m v] figure 13 . reset release voltage vs temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 temparature:ta[ ] reset voltage:vpor[v] temperature : ta [c] reset voltage : v por [v] downloaded from: http:///
bh2219fvm bh2220fvm 7/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application information operation description the serial control interface is 3-line serial interface 1) ld, 2) clk a nd 3) di. every command is composed of 12 bits data sent through di line (msb first). di data is read every rising edge of the clk. that should be whil e ld is l ow . last 12 bits of data are latched while ld is high. figure 16 data settings d0 d1 d2 d3 d4 d5 d6 d7 setting 0 0 0 0 0 0 0 0 gnd 1 0 0 0 0 0 0 0 (v cc -gnd)/256x1 0 1 0 0 0 0 0 0 (v cc -gnd)/256x2 1 1 0 0 0 0 0 0 (v cc -gnd)/256x3 0 0 1 0 0 0 0 0 (v cc -gnd)/256x4 0 1 1 1 1 1 1 1 (v cc -gnd)/256x254 1 1 1 1 1 1 1 1 (v cc -gnd)/256x255 channel setting (bh2219fvm) d8 d9 d10 d11 setting 0 0 x x ao1 1 0 x x ao2 0 1 x x not used 1 1 x x not used channel setting (bh2220fvm) d8 d9 d10 d11 setting 0 0 x x ao1 1 0 x x ao2 0 1 x x ao3 1 1 x x not used clk d11 x x d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 ld 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. di downloaded from: http:///
bh2219fvm bh2220fvm 8/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 power dissipation ? msop8 board size: 70 mm x 70 mm x 1.6mm material : fr4 glass epoxy board (copper foil area less than 3%) i/o equivalent circuit terminal equivalent circuit terminal equivalent circuit ao1 ao2 ao3 di clk ld vcc vcc gnd gnd vcc vcc gnd gnd 0 0. 1 0. 2 0. 3 0. 4 0.5 0 25 50 75 100 125 temperature : ta [c] power dissipation : pd [w] downloaded from: http:///
bh2219fvm bh2220fvm 9/ 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the a nalog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trace s, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and th ick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the cond itions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to st ress. always discharge capacitors completely after each p rocess or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins durin g assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small ch arge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
bh2219fvm bh2220fvm 10 / 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor . parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd v oltage to an input pin (and thus to the p substrate) should be avoided. figure 17. example of monolithic ic structure 13. reset function the power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons. therefore, set the time constant so as to satisfy the power source rise time. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
bh2219fvm bh2220fvm 11 / 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b h 2 2 x x f v m - t r part number 2219 2220 package fvm: msop8 packaging and forming specification tr : embossed tape and reel marking diagram part number part number marking bh2219fvm-tr h2219 bh2220fvm- tr h2220 msop8(top view) part number marking lot number 1pin mark downloaded from: http:///
bh2219fvm bh2220fvm 12 / 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name msop8 downloaded from: http:///
bh2219fvm bh2220fvm 13 / 13 tsz02201-0m2m0gz15050-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 06.nov.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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